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Low-Power CMOS Digital Pixel Imagers for High-Speed Uncooled PbSe IR Applications

机译:用于高速非冷却PbSe红外应用的低功耗CMOS数字像素成像仪

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摘要

This PhD dissertation describes the research and development of a new low-cost medium wavelength IR (MWIR) monolithic imager technology for high-speed uncooled industrial applications. It takes the baton on the latest technological advances in the field of vapour phase deposition (VPD) PbSe-based MWIR detection accomplished by the industrial partner NIT S.L., adding fundamental knowledge on the investigation of novel VLSI analog and mixed-signal design techniques at circuit and system levels for the development of the readout integrated device attached to the detector.\ud\udThe work supports on the hypothesis that, by the use of the preceding design techniques, current standard inexpensive CMOS technologies fulfill all operational requirements of the VPD PbSe detector in terms of connectivity, reliability, functionality and scalability to integrate the device. The resulting monolithic PbSe-CMOS camera must consume very low power, operate at kHz frequencies, exhibit good uniformity and fit the CMOS read-out active pixels in the compact pitch of the focal plane, all while addressing the particular characteristics of the MWIR detector: high dark-to-signal ratios, large input parasitic capacitance values and remarkable mismatching in PbSe integration.\ud\udIn order to achieve these demands, this thesis proposes null inter-pixel crosstalk vision sensor architectures based on a digital-only focal plane array (FPA) of configurable pixel sensors. Each digital pixel sensor (DPS) cell is equipped with fast communication modules, self-biasing, offset cancellation, analog-to-digital converter (ADC) and fixed pattern noise (FPN) correction. In-pixel power consumption is minimized by the use of comprehensive MOSFET subthreshold operation.\ud\udThe main aim is to potentiate the integration of PbSe-based infra-red (IR)-image sensing technologies so as to widen its use, not only in distinct scenarios, but also at different stages of PbSe-CMOS integration maturity. For this purpose, we posit to investigate a comprehensive set of functional blocks distributed in two parallel approaches:\ud\ud- Frame-based "Smart" MWIR imaging based on new DPS circuit topologies with gain and offset FPN correction capabilities. This research line exploits the detector pitch to offer fully-digital programmability at pixel level and complete functionality with input parasitic capacitance compensation and internal frame memory. \ud\ud- Frame-free "Compact"-pitch MWIR vision based on a novel DPS loss-less analog integrator and configurable temporal difference, combined with asynchronous communication protocols inside the focal plane. This strategy is conceived to allow extensive pitch compaction and readout speed increase by the suppression of in-pixel digital filtering, and the use of dynamic bandwidth allocation in each pixel of the FPA.\ud\udIn order make the electrical validation of first prototypes independent of the expensive PbSe deposition processes at wafer level, investigation is extended as well to the development of affordable sensor emulation strategies and integrated test platforms specifically oriented to image read-out integrated circuits. DPS cells, imagers and test chips have been integrated and characterized in standard 0.15-micron 1P6M, 0.35-micron 2P4M and 2.5-micron 2P1M CMOS technologies, all as part of research projects with industrial partnership.\ud\udThe research has led to the first high-speed uncooled frame-based IR quantum imager monolithically fabricated in a standard VLSI CMOS technology, and has given rise to the Tachyon series [1], a new line of commercial IR cameras used in real-time industrial, environmental and transportation control systems. The frame-free architectures investigated in this work represent a firm step forward to push further pixel pitch and system bandwidth up to the limits imposed by the evolving PbSe detector in future generations of the device.
机译:这篇博士论文描述了一种用于高速非冷却工业应用的新型低成本中波长红外单片成像器技术的研究与开发。它是由工业合作伙伴NIT SL完成的基于气相沉积(VPD)基于PbSe的MWIR检测领域的最新技术进展的接力棒,为电路上新型VLSI模拟和混合信号设计技术的研究提供了基础知识\ ud \ ud该工作支持以下假设:通过使用先前的设计技术,当前的标准廉价CMOS技术可以满足VPD PbSe检测器的所有操作要求在连接设备的连接性,可靠性,功能性和可扩展性方面。最终的单片PbSe-CMOS相机必须消耗极低的功率,以kHz频率运行,表现出良好的均匀性并以焦平面的紧凑间距适合CMOS读出有源像素,同时还要解决MWIR检测器的特殊特性:为了达到这些要求,本文提出了一种基于纯数字焦平面阵列的空像素间串扰视觉传感器架构,以实现高要求的暗信噪比,大输入寄生电容值以及PbSe集成中的明显失配。 (FPA)的可配置像素传感器。每个数字像素传感器(DPS)单元都配备了快速通信模块,自偏置,偏移消除,模数转换器(ADC)和固定模式噪声(FPN)校正。通过使用全面的MOSFET亚阈值操作,可以将像素内功耗降至最低。\ ud \ ud主要目的是增强基于PbSe的红外(IR)图像传感技术的集成,从而扩大其应用范围,不仅在不同的场景中,而且在PbSe-CMOS集成成熟度的不同阶段。为此,我们假定研究以两种并行方法分布的功能块的全面集合:\ ud \ ud基于帧的“智能” MWIR成像,基于具有增益和偏移FPN校正功能的新型DPS电路拓扑。该研究线利用检测器间距来提供像素级的全数字可编程性,并具有输入寄生电容补偿和内部帧存储器的完整功能。 \ ud \ ud-基于新颖的DPS无损模拟积分器和可配置的时差的无帧“紧凑”间距MWIR视觉,并结合了焦平面内的异步通信协议。该策略旨在通过抑制像素内数字滤波以及在FPA的每个像素中使用动态带宽分配来实现广泛的音调压缩和读出速度的提高。\ ud \ ud为了使第一个原型的电气验证独立在晶圆级昂贵的PbSe沉积工艺中,研究也扩展到了可负担的传感器仿真策略和专门针对图像读出集成电路的集成测试平台的开发。 DPS单元,成像器和测试芯片已经通过标准0.15微米1P6M,0.35微米2P4M和2.5微米2P1M CMOS技术进行了集成和表征,所有这些都是与业界合作研究项目的一部分。第一款以标准VLSI CMOS技术整体制造的高速非制冷基于帧的红外量子成像仪,并产生了Tachyon系列[1],这是一种用于实时工业,环境和运输控制的新型商业IR摄像机系列系统。在这项工作中研究的无帧体系结构代表了向前迈出的坚实一步,以将进一步的像素间距和系统带宽提高到设备下一代中不断发展的PbSe检测器所施加的极限。

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